ASM / SIEMENS Additional component vision module SIPLACE 80 F/F4/F5 for flip chip bump centering. Field of view: 9mmx11.5mm. Largest flip chip with single measurement: 7mm x 9mm.Smallest,reliably recognizable bump diameter: 0,1mm. Reliable processing of IC pitch: 0,25mm - 00116416S01

ASM / SIEMENS Additional component vision module SIPLACE 80 F/F4/F5 for flip chip bump centering. Field of view: 9mmx11.5mm. Largest flip chip with single measurement: 7mm x 9mm.Smallest,reliably recognizable bump diameter: 0,1mm. Reliable processing of IC pitch: 0,25mm – 00116416S01

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ASM / SIEMENS Additional component vision module SIPLACE 80 F/F4/F5 for flip chip bump centering. Field of view: 9mmx11.5mm. Largest flip chip with single measurement: 7mm x 9mm.Smallest,reliably recognizable bump diameter: 0,1mm. Reliable processing of IC pitch: 0,25mm – 00116416S01

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